News & Articles

Total contract ceiling increases to $88 million as QuickLogic achieves key milestone with test chip tape-out for mission-critical defense and space systems.

New Qualcomm-based modular architecture offers pin-to-pin upgradability and a decade of lifecycle support for AI-driven defense and industrial applications.

The new Helium family leverages silicon photonics to provide high-resolution depth and velocity sensing in an ultra-compact, software-defined package for autonomous systems.

Successful testing enables the use of cost-effective, high-bandwidth HYPERRAM with the AMD MicroBlaze V processor for embedded AI and I/O expansion applications.

The update introduces solutions for real-time human fall detection, energy-efficient object recognition, and automated land-cover change analysis across diverse embedded platforms.

EMASS's ECS-DoT AI chips integrate with Semtech's LoRa transceivers to provide long-range, battery-efficient intelligence for IoT systems requiring on-device data processing.

Joint research demonstrates a path toward high-performance, cost-effective, and fully integrated radio frequency and optical front-end modules using layered silicon technologies.

Siemens and nVent collaborate on a Tier III-capable reference architecture that combines industrial electrical systems with advanced liquid cooling to accelerate AI infrastructure deployment and efficiency.